New power electronics components concept for automated manufacturing

I Josifovic; J Popovi¿-Gerber; JA Ferreira

New power electronics components concept for automated manufacturing

I Josifovic, J Popovi¿-Gerber, JA Ferreira

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

This paper introduces a new concept for surface mount technology (SMT) automated manufacturing of power converters - PCB power sandwich. The power sandwich manufacturing method employs new x-dimension (x-dim) components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and soldered on both, top and bottom sides using the multilayer power sandwich assembly process. By arranging the components in different stack layers an increase in power density, better heat removal and improved EMI performance of power converters can be achieved. New x-dim components enable fully SMT automated power converters manufacturing with short production time and low assembly cost.

Original language	Undefined/Unknown
Title of host publication	Proceedings 13th European conference on Power Electronics and Applications, 2009. EPE '09
Editors	s.n.
Publisher	IEEE Society
Pages	1-10
Number of pages	10
ISBN (Print)	978-1-4244-4432-8
Publication status	Published - 2009

Publication series

Name
Publisher	IEEE

Keywords

Conf.proc. > 3 pag

Cite this

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title = "New power electronics components concept for automated manufacturing",

abstract = "This paper introduces a new concept for surface mount technology (SMT) automated manufacturing of power converters - PCB power sandwich. The power sandwich manufacturing method employs new x-dimension (x-dim) components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and soldered on both, top and bottom sides using the multilayer power sandwich assembly process. By arranging the components in different stack layers an increase in power density, better heat removal and improved EMI performance of power converters can be achieved. New x-dim components enable fully SMT automated power converters manufacturing with short production time and low assembly cost.",

keywords = "Conf.proc. > 3 pag",

author = "I Josifovic and J Popovi¿-Gerber and JA Ferreira",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4432-8",

publisher = "IEEE Society",

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New power electronics components concept for automated manufacturing. / Josifovic, I; Popovi¿-Gerber, J; Ferreira, JA.
Proceedings 13th European conference on Power Electronics and Applications, 2009. EPE '09. ed. / s.n. IEEE Society, 2009. p. 1-10.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - New power electronics components concept for automated manufacturing

AU - Josifovic, I

AU - Popovi¿-Gerber, J

AU - Ferreira, JA

PY - 2009

Y1 - 2009

N2 - This paper introduces a new concept for surface mount technology (SMT) automated manufacturing of power converters - PCB power sandwich. The power sandwich manufacturing method employs new x-dimension (x-dim) components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and soldered on both, top and bottom sides using the multilayer power sandwich assembly process. By arranging the components in different stack layers an increase in power density, better heat removal and improved EMI performance of power converters can be achieved. New x-dim components enable fully SMT automated power converters manufacturing with short production time and low assembly cost.

AB - This paper introduces a new concept for surface mount technology (SMT) automated manufacturing of power converters - PCB power sandwich. The power sandwich manufacturing method employs new x-dimension (x-dim) components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and soldered on both, top and bottom sides using the multilayer power sandwich assembly process. By arranging the components in different stack layers an increase in power density, better heat removal and improved EMI performance of power converters can be achieved. New x-dim components enable fully SMT automated power converters manufacturing with short production time and low assembly cost.

KW - Conf.proc. > 3 pag

UR - http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5278949&isnumber=5278662

M3 - Conference contribution

SN - 978-1-4244-4432-8

SP - 1

EP - 10

BT - Proceedings 13th European conference on Power Electronics and Applications, 2009. EPE '09

A2 - s.n., null

PB - IEEE Society

ER -

New power electronics components concept for automated manufacturing

Abstract

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