Novel damage model for delamination in Cu/low-k IC backend structures

MAJ van Gils, O van der Sluis, GQ Zhang, JHJ Janssen, RMJ Voncken

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of the 55th Electronic Components and Technology Conference
Editors s.n.
Place of PublicationPiscataway, NJ
PublisherIEEE Society
Pages988-994
Number of pages7
ISBN (Print)0-7803-8906-9
Publication statusPublished - 2005
Event55th Electronic Components and Technology Conference, Lake Buena Vista, FL - Piscataway, NJ
Duration: 31 May 20053 Jun 2005

Publication series

Name
PublisherIEEE

Conference

Conference55th Electronic Components and Technology Conference, Lake Buena Vista, FL
Period31/05/053/06/05

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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