@inproceedings{0a14448bbeb749e2aa6b71a7c29dd0e4,
title = "Novel damage model for delamination in Cu/low-k IC backend structures",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "{van Gils}, MAJ and {van der Sluis}, O and GQ Zhang and JHJ Janssen and RMJ Voncken",
year = "2005",
language = "Undefined/Unknown",
isbn = "0-7803-8906-9",
publisher = "IEEE Society",
pages = "988--994",
editor = "s.n.",
booktitle = "Proceedings of the 55th Electronic Components and Technology Conference",
note = "55th Electronic Components and Technology Conference, Lake Buena Vista, FL ; Conference date: 31-05-2005 Through 03-06-2005",
}