Novel system-in-package design and packaging solution for solid state lighting systems

M Dong; F Santagata; J Wei; C Yuan; GQ Zhang

doi:10.1109/ECTC.2014.6897442

Novel system-in-package design and packaging solution for solid state lighting systems

M Dong, F Santagata, J Wei, C Yuan, GQ Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	Proceedings - 64th Electronic Components and Technology Conference
Editors	W Sauter, A Huffman
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	1192-1197
Number of pages	6
ISBN (Print)	978-147992407-3
DOIs	https://doi.org/10.1109/ECTC.2014.6897442
Publication status	Published - 2014
Event	ECTC 2014, Orlando, Florida - Piscataway, NJ, USA Duration: 27 May 2014 → 30 May 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	ECTC 2014, Orlando, Florida
Period	27/05/14 → 30/05/14

Bibliographical note

Harvest

Access to Document

10.1109/ECTC.2014.6897442

Cite this

@inproceedings{77f357edfb164b64b040ccdee56135e1,

title = "Novel system-in-package design and packaging solution for solid state lighting systems",

author = "M Dong and F Santagata and J Wei and C Yuan and GQ Zhang",

note = "Harvest; ECTC 2014, Orlando, Florida ; Conference date: 27-05-2014 Through 30-05-2014",

year = "2014",

doi = "10.1109/ECTC.2014.6897442",

language = "English",

isbn = "978-147992407-3",

publisher = "IEEE Society",

pages = "1192--1197",

editor = "W Sauter and A Huffman",

booktitle = "Proceedings - 64th Electronic Components and Technology Conference",

}

Dong, M, Santagata, F, Wei, J, Yuan, C & Zhang, GQ 2014, Novel system-in-package design and packaging solution for solid state lighting systems. in W Sauter & A Huffman (eds), Proceedings - 64th Electronic Components and Technology Conference. IEEE Society, Piscataway, NJ, USA, pp. 1192-1197, ECTC 2014, Orlando, Florida, 27/05/14. https://doi.org/10.1109/ECTC.2014.6897442

Novel system-in-package design and packaging solution for solid state lighting systems. / Dong, M; Santagata, F; Wei, J et al.
Proceedings - 64th Electronic Components and Technology Conference. ed. / W Sauter; A Huffman. Piscataway, NJ, USA: IEEE Society, 2014. p. 1192-1197.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Novel system-in-package design and packaging solution for solid state lighting systems

AU - Dong, M

AU - Santagata, F

AU - Wei, J

AU - Yuan, C

AU - Zhang, GQ

N1 - Harvest

PY - 2014

Y1 - 2014

U2 - 10.1109/ECTC.2014.6897442

DO - 10.1109/ECTC.2014.6897442

M3 - Conference contribution

SN - 978-147992407-3

SP - 1192

EP - 1197

BT - Proceedings - 64th Electronic Components and Technology Conference

A2 - Sauter, W

A2 - Huffman, A

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - ECTC 2014, Orlando, Florida

Y2 - 27 May 2014 through 30 May 2014

ER -