Novel wafer-through technique for interconnects

VG Kiutchoukov, JR Mollinger, A Bossche

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of SPIE Vol. 4593
Editors	PD Franzon
Place of Publication	Bellingham
Publisher	SPIE
Pages	274-282
Number of pages	9
ISBN (Print)	0-8194-4323-9
Publication status	Published - 2001
Event	Design, Characterization, and Packaging for MEMS and Microelectronics II, Adelaide - Bellingham Duration: 17 Dec 2001 → 19 Dec 2001

Name
Publisher	SPIE Press

Conference	Design, Characterization, and Packaging for MEMS and Microelectronics II, Adelaide
Period	17/12/01 → 19/12/01

Keywords

@inproceedings{8d8116c5a2214e35a1f4d0984618e733,

title = "Novel wafer-through technique for interconnects",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "VG Kiutchoukov and JR Mollinger and A Bossche",

year = "2001",

language = "Undefined/Unknown",

isbn = "0-8194-4323-9",

publisher = "SPIE",

pages = "274--282",

editor = "{PD Franzon}",

booktitle = "Proceedings of SPIE Vol. 4593",

address = "United States",

note = "Design, Characterization, and Packaging for MEMS and Microelectronics II, Adelaide ; Conference date: 17-12-2001 Through 19-12-2001",

}

TY - GEN

T1 - Novel wafer-through technique for interconnects

AU - Kiutchoukov, VG

AU - Mollinger, JR

AU - Bossche, A

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-8194-4323-9

SP - 274

EP - 282

BT - Proceedings of SPIE Vol. 4593

A2 - PD Franzon, null

PB - SPIE

CY - Bellingham

T2 - Design, Characterization, and Packaging for MEMS and Microelectronics II, Adelaide

Y2 - 17 December 2001 through 19 December 2001

ER -