Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packaging polymer , the equilibrium moduli are modeled with a model based on scaling analysis and the relaxation behavior of the transient part is described by the cure-dependent relaxation amplitude and reduced relaxation times which are based on the time-conversion superposition principle. The cure-dependent parameters are characterized by using an integrated approach of dynamical mechanical analysis (DMA) and differential scanning calorimetry (DSC) measurements. Finite element modeling is carried out for three configurations of a carrier package during the curing process has significant contribution on the toal warpage of the map.
|Number of pages||9|
|Publication status||Published - 2007|
- academic journal papers
- CWTS JFIS < 0.75
Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL., & Janssen, JHJ. (2007). Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability, 47, 310-318.