Numerical prediction of failure paths at a roughened metal/polymer interface

SPM Noijen, O van der Sluis, PHM Timmermans, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

13 Citations (Scopus)

Abstract

Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. This paper extends the investigation of Yao and Qu presented in [Yao Q, Qu J. Interfacial versus cohesive failure on polymer-metal interfaces in electronic packaging - effects of interface roughness. J Electr Packag 2002; 124; 127-34] towards a numerical fracture mechanics model that is used to quantitatively predict the relation between cohesive and adhesive failure on a metal-polymer interface. As example, an epoxy-aluminum interface is investigated. The competition between adhesive and cohesive failure depending on surface roughness parameters will be studied. Understanding of these phenomena could enable the optimization of interface properties for different applications.
Original languageUndefined/Unknown
Pages (from-to)1315-1318
Number of pages4
JournalMicroelectronics Reliability
Volume49
Issue number2009
Publication statusPublished - 2009

Keywords

  • academic journal papers
  • CWTS JFIS < 0.75

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