Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. This paper extends the investigation of Yao and Qu presented in [Yao Q, Qu J. Interfacial versus cohesive failure on polymer-metal interfaces in electronic packaging - effects of interface roughness. J Electr Packag 2002; 124; 127-34] towards a numerical fracture mechanics model that is used to quantitatively predict the relation between cohesive and adhesive failure on a metal-polymer interface. As example, an epoxy-aluminum interface is investigated. The competition between adhesive and cohesive failure depending on surface roughness parameters will be studied. Understanding of these phenomena could enable the optimization of interface properties for different applications.
|Number of pages||4|
|Publication status||Published - 2009|
- academic journal papers
- CWTS JFIS < 0.75