@inproceedings{d5f477a3d3b74adfa1987cf95899401d,
title = "On-chip isolation in wafer-level chip-scale packages: substrate thinning and circuit partitioning by trenches",
keywords = "Conf.proc. > 3 pag",
author = "SM Sinaga and A Poliakov and M Bartek and JN Burghartz",
year = "2003",
language = "Undefined/Unknown",
isbn = "0-930815-71-8",
publisher = "IMAPS",
pages = "768--773",
editor = "s.n.",
booktitle = "Proceedings 2003 international symposium on microelectronics",
note = "null ; Conference date: 16-11-2003 Through 20-11-2003",
}