On-chip isolation in wafer-level chip-scale packages: substrate thinning and circuit partitioning by trenches

SM Sinaga, A Poliakov, M Bartek, JN Burghartz

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    2 Citations (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationProceedings 2003 international symposium on microelectronics
    Editors s.n.
    Place of PublicationWashington
    PublisherIMAPS
    Pages768-773
    Number of pages6
    ISBN (Print)0-930815-71-8
    Publication statusPublished - 2003
    Event2003 international symposium on microelectronics, Boston - Washington
    Duration: 16 Nov 200320 Nov 2003

    Publication series

    Name
    PublisherIMAPS

    Conference

    Conference2003 international symposium on microelectronics, Boston
    Period16/11/0320/11/03

    Keywords

    • Conf.proc. > 3 pag

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