On Modeling and Optimizing Cost in 3D Stacked-ICs

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	6th IEEE International Design and Test Workshop during ICECS 2011
Editors	M Sawan, H Harmanani
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	24-29
Number of pages	6
ISBN (Print)	978-1-4673-0469-6
DOIs	https://doi.org/10.1109/IDT.2011.6123096
Publication status	Published - 2011
Event	IDT 2011 - Piscataway, NJ, USA Duration: 12 Dec 2011 → 14 Dec 2011

Name
Publisher	IEEE

Conference	IDT 2011
Period	12/12/11 → 14/12/11

Access to Document

@inproceedings{b47b5339beed4e8c92ba5557d90e4385,

title = "On Modeling and Optimizing Cost in 3D Stacked-ICs",

author = "M Taouil and S Hamdioui and E Marinissen",

year = "2011",

doi = "10.1109/IDT.2011.6123096",

language = "English",

isbn = "978-1-4673-0469-6",

publisher = "IEEE Society",

pages = "24--29",

editor = "M Sawan and H Harmanani",

booktitle = "6th IEEE International Design and Test Workshop during ICECS 2011",

note = "IDT 2011 ; Conference date: 12-12-2011 Through 14-12-2011",

}

TY - GEN

T1 - On Modeling and Optimizing Cost in 3D Stacked-ICs

AU - Taouil, M

AU - Hamdioui, S

AU - Marinissen, E

PY - 2011

Y1 - 2011

U2 - 10.1109/IDT.2011.6123096

DO - 10.1109/IDT.2011.6123096

M3 - Conference contribution

SN - 978-1-4673-0469-6

SP - 24

EP - 29

BT - 6th IEEE International Design and Test Workshop during ICECS 2011

A2 - Sawan, M

A2 - Harmanani, H

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - IDT 2011

Y2 - 12 December 2011 through 14 December 2011

ER -