On the effect of cure-residual stress on flip chip failure prediction

LJ Ernst; D Yang; KMB Jansen; C van t Hof; GQ Zhang; WD van Driel

On the effect of cure-residual stress on flip chip failure prediction

LJ Ernst, D Yang, KMB Jansen, C van t Hof, GQ Zhang, WD van Driel

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of 4th electronics packaging technology conference (EPTC 2002)
Editors	C Lee, TK Chuan, MK Iyer
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	398-403
Number of pages	6
ISBN (Print)	0-7803-7435-5
Publication status	Published - 2002
Event	Proceedings of 4th electronics packaging technology conference (EPTC 2002) - Singapore, Singapore Duration: 10 Dec 2002 → 12 Dec 2002

Publication series

Name
Publisher	IEEE

Conference

Conference	Proceedings of 4th electronics packaging technology conference (EPTC 2002)
Country/Territory	Singapore
City	Singapore
Period	10/12/02 → 12/12/02

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{796b5bb6f8104186820a928a4307804f,

title = "On the effect of cure-residual stress on flip chip failure prediction",

keywords = "Conf.proc. > 3 pag",

author = "LJ Ernst and D Yang and KMB Jansen and {van t Hof}, C and GQ Zhang and {van Driel}, WD",

year = "2002",

language = "Undefined/Unknown",

isbn = "0-7803-7435-5",

publisher = "IEEE Society",

pages = "398--403",

editor = "C Lee and TK Chuan and MK Iyer",

booktitle = "Proceedings of 4th electronics packaging technology conference (EPTC 2002)",

note = "Proceedings of 4th electronics packaging technology conference (EPTC 2002) ; Conference date: 10-12-2002 Through 12-12-2002",

}

Ernst, LJ, Yang, D, Jansen, KMB, van t Hof, C, Zhang, GQ & van Driel, WD 2002, On the effect of cure-residual stress on flip chip failure prediction. in C Lee, TK Chuan & MK Iyer (eds), Proceedings of 4th electronics packaging technology conference (EPTC 2002). IEEE Society, Piscataway, pp. 398-403, Proceedings of 4th electronics packaging technology conference (EPTC 2002), Singapore, Singapore, 10/12/02.

On the effect of cure-residual stress on flip chip failure prediction. / Ernst, LJ; Yang, D; Jansen, KMB et al.
Proceedings of 4th electronics packaging technology conference (EPTC 2002). ed. / C Lee; TK Chuan; MK Iyer. Piscataway: IEEE Society, 2002. p. 398-403.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - On the effect of cure-residual stress on flip chip failure prediction

AU - Ernst, LJ

AU - Yang, D

AU - Jansen, KMB

AU - van t Hof, C

AU - Zhang, GQ

AU - van Driel, WD

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7435-5

SP - 398

EP - 403

BT - Proceedings of 4th electronics packaging technology conference (EPTC 2002)

A2 - Lee, C

A2 - Chuan, TK

A2 - Iyer, MK

PB - IEEE Society

CY - Piscataway

T2 - Proceedings of 4th electronics packaging technology conference (EPTC 2002)

Y2 - 10 December 2002 through 12 December 2002

ER -