On the effect of cure-residual stress on flip chip failure prediction

LJ Ernst, D Yang, KMB Jansen, C van t Hof, GQ Zhang, WD van Driel

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationProceedings of 4th electronics packaging technology conference (EPTC 2002)
EditorsC Lee, TK Chuan, MK Iyer
Place of PublicationPiscataway
PublisherIEEE Society
Pages398-403
Number of pages6
ISBN (Print)0-7803-7435-5
Publication statusPublished - 2002
EventProceedings of 4th electronics packaging technology conference (EPTC 2002) - Singapore, Singapore
Duration: 10 Dec 200212 Dec 2002

Publication series

Name
PublisherIEEE

Conference

ConferenceProceedings of 4th electronics packaging technology conference (EPTC 2002)
CountrySingapore
CitySingapore
Period10/12/0212/12/02

Keywords

  • Conf.proc. > 3 pag

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