On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationProceedings 63rd Electronic Components and Technology Conference (ECTC 2013)
EditorsW Sauter
Place of PublicationPiscataway
PublisherIEEE Society
Pages192-199
Number of pages8
ISBN (Print)978-1-4799-0233-0
DOIs
Publication statusPublished - 2013
EventECTC 2013, Las Vegas, Nevada - Piscataway
Duration: 28 May 201331 May 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceECTC 2013, Las Vegas, Nevada
Period28/05/1331/05/13

Bibliographical note

Harvest

Keywords

  • Conf.proc. > 3 pag

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