Opportunities for applications of electrochemical deposition of copper for filling holes and channals in silicon wafer structures

VG Kiutchukov, Ph Philipov, C Schmidt

Research output: Contribution to journal › Article › Professional

Original language	Undefined/Unknown
Pages (from-to)	8-10
Number of pages	3
Journal	Elektrotechnica & Elektronica
Volume	35
Issue number	3-4
Publication status	Published - 2001

Keywords

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title = "Opportunities for applications of electrochemical deposition of copper for filling holes and channals in silicon wafer structures",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "VG Kiutchukov and Ph Philipov and C Schmidt",

year = "2001",

language = "Undefined/Unknown",

volume = "35",

pages = "8--10",

journal = "Elektrotechnica & Elektronica",

issn = "0861-4717",

number = "3-4",

}

TY - JOUR

T1 - Opportunities for applications of electrochemical deposition of copper for filling holes and channals in silicon wafer structures

AU - Kiutchukov, VG

AU - Philipov, Ph

AU - Schmidt, C

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Article

SN - 0861-4717

VL - 35

SP - 8

EP - 10

JO - Elektrotechnica & Elektronica

JF - Elektrotechnica & Elektronica

IS - 3-4

ER -