Optical data link assembly for 360 µm diameter IVUS on guidewire imaging devices

R Stoute; MC Louwerse; J van Rens; VA Henneken; R Dekker

doi:10.1109/ICSENS.2014.6984972

Optical data link assembly for 360 µm diameter IVUS on guidewire imaging devices

R Stoute, MC Louwerse, J van Rens, VA Henneken, R Dekker

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Original language	English
Title of host publication	Proceedings - IEEE Sensors 2014
Editors	FJ Arregui
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	217-220
Number of pages	4
ISBN (Print)	978-1-4799-0161-6
DOIs	https://doi.org/10.1109/ICSENS.2014.6984972
Publication status	Published - 2014
Event	IEEE Sensors 2014 - Valencia Conference Centre, Valencia, Spain Duration: 2 Nov 2014 → 5 Nov 2014 http://ieee-sensors2014.org/

Publication series

Name
Publisher	IEEE

Conference

Conference	IEEE Sensors 2014
Country/Territory	Spain
City	Valencia
Period	2/11/14 → 5/11/14
Internet address	http://ieee-sensors2014.org/

Bibliographical note

Harvest

Access to Document

10.1109/ICSENS.2014.6984972

Cite this

@inproceedings{bfa9e12f0939499aa980b29b2219b037,

title = "Optical data link assembly for 360 µm diameter IVUS on guidewire imaging devices",

author = "R Stoute and MC Louwerse and {van Rens}, J and VA Henneken and R Dekker",

note = "Harvest; IEEE Sensors 2014 ; Conference date: 02-11-2014 Through 05-11-2014",

year = "2014",

doi = "10.1109/ICSENS.2014.6984972",

language = "English",

isbn = "978-1-4799-0161-6",

publisher = "IEEE",

pages = "217--220",

editor = "FJ Arregui",

booktitle = "Proceedings - IEEE Sensors 2014",

address = "United States",

url = "http://ieee-sensors2014.org/",

}

TY - GEN

T1 - Optical data link assembly for 360 µm diameter IVUS on guidewire imaging devices

AU - Stoute, R

AU - Louwerse, MC

AU - van Rens, J

AU - Henneken, VA

AU - Dekker, R

N1 - Harvest

PY - 2014

Y1 - 2014

U2 - 10.1109/ICSENS.2014.6984972

DO - 10.1109/ICSENS.2014.6984972

M3 - Conference contribution

SN - 978-1-4799-0161-6

SP - 217

EP - 220

BT - Proceedings - IEEE Sensors 2014

A2 - Arregui, FJ

PB - IEEE

CY - Piscataway, NJ, USA

T2 - IEEE Sensors 2014

Y2 - 2 November 2014 through 5 November 2014

ER -