Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane

W. J. Westerveld, S. M. Leinders, P. L.M.J. Van Neer, H. P. Urbach, N. De Jong, M. D. Verweij, X. Rottenberg, V. Rochus

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicon-dioxide acoustical membrane. This work presents new OMUS modelling: acousto-mechanical non-linear FEM and photonic circuit equations. We show that initial wafer stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up-or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary (b) for the design of robust and sensitive sensors.

Original languageEnglish
Title of host publication2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
EditorsWillem van Driel
Place of PublicationPiscataway, NJ, USA
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages7
ISBN (Electronic)978-1-5386-8040-7
DOIs
Publication statusPublished - 2019
Event20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Hannover, Germany
Duration: 24 Mar 201927 Mar 2019
Conference number: 20th

Conference

Conference20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
CountryGermany
CityHannover
Period24/03/1927/03/19

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