Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging

J Tang; JBJ Schelen; CIM Beenakker

doi:10.1109/ICEPT.2010.5582713

Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

8 Citations (Scopus)

Original language	English
Title of host publication	Proceedings ICEPT-HDP 2010
Editors	K Bi
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	1034-1038
Number of pages	5
ISBN (Print)	978-1-4244-8142-2
DOIs	https://doi.org/10.1109/ICEPT.2010.5582713
Publication status	Published - 2010
Event	11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China - Piscataway, NJ, USA Duration: 16 Aug 2010 → 19 Aug 2010

Publication series

Name
Publisher	IEEE

Conference

Conference	11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China
Period	16/08/10 → 19/08/10

Keywords

Conf.proc. > 3 pag

Access to Document

10.1109/ICEPT.2010.5582713

Cite this

@inproceedings{ee3153ff124343688daf814677391a06,

title = "Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging",

keywords = "Conf.proc. > 3 pag",

author = "J Tang and JBJ Schelen and CIM Beenakker",

year = "2010",

doi = "10.1109/ICEPT.2010.5582713",

language = "English",

isbn = "978-1-4244-8142-2",

publisher = "IEEE Society",

pages = "1034--1038",

editor = "K Bi",

booktitle = "Proceedings ICEPT-HDP 2010",

note = "11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China ; Conference date: 16-08-2010 Through 19-08-2010",

}

Tang, J, Schelen, JBJ & Beenakker, CIM 2010, Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging. in K Bi (ed.), Proceedings ICEPT-HDP 2010. IEEE Society, Piscataway, NJ, USA, pp. 1034-1038, 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, 16/08/10. https://doi.org/10.1109/ICEPT.2010.5582713

TY - GEN

T1 - Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging

AU - Tang, J

AU - Schelen, JBJ

AU - Beenakker, CIM

PY - 2010

Y1 - 2010

KW - Conf.proc. > 3 pag

U2 - 10.1109/ICEPT.2010.5582713

DO - 10.1109/ICEPT.2010.5582713

M3 - Conference contribution

SN - 978-1-4244-8142-2

SP - 1034

EP - 1038

BT - Proceedings ICEPT-HDP 2010

A2 - Bi, K

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China

Y2 - 16 August 2010 through 19 August 2010

ER -