Optimization techniques for grayscale photolithography

FCM van Kempen, F van Keulen, Y Hirai, O Tabata

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review


With the ongoing development of thick photoresists, promising possibilities have emerged to use these transparent and flexible layers for micro-structures and micropatterns directly and not exclusively as a sacrificial layer in the processing. These 3D polymer microstructures have many potential applications in the field of MEMS: including micro-sensors and actuators, micro-optics and micro-fluidics. Using modern 3D exposure techniques, it is possible to vary the dissolution rate of thick photo resists locally and create complex relief-type three-dimensional structures in just one exposure and development cycle. Unfortunately, realizing the proper exposure conditions needed for a specific 3D micro pattern is complicated, because of the non-linear and smoothing nature of the physical processes. Nowadays, the most widely used approach is based on trial-and-error designed exposure conditions. In this research a systematic approach is developed, based on computational process simulation, associated adjoint sensitivity analysis and optimization techniques.
Original languageEnglish
Title of host publicationProceedings of the 9th ASMO UK Conference Engineering Design Optimization, 5-6 July 2012, Cork, Ireland
EditorsD Kelliher, OM Querin, VV Toropov, J Sienz
Place of PublicationCork, Ireland
Number of pages8
ISBN (Print)978-0-85316-311-4
Publication statusPublished - 2012
Event9th ASMO UK Conference Engineering Design Optimization, Cork, Ireland - Cork, Ireland
Duration: 5 Jul 20136 Jul 2013

Publication series

PublisherASMO UK


Conference9th ASMO UK Conference Engineering Design Optimization, Cork, Ireland


  • conference contrib. refereed
  • Conf.proc. > 3 pag


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