Optimizing Temperature and Flow Fields of 4H-SiC Epitaxial Growth by Integrating CFD Simulation with Multi-objective Particle Swarm Optimization

Jing Tian, Zhuorui Tang, Hongyu Tang, Jiajie Fan*, Guoqi Zhng

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

The silicon carbide (SiC) epitaxial growth process is crucial in chip manufacturing. The distribution of the flow and temperature fields in the reactor chamber influences the epitaxial layer uniformity. Therefore, this study optimizes the distribution of the flow and temperature fields inside the reactor to enhance the quality of the epitaxial layer. COMSOL Multiphysics is used to model the horizontal chemical vapor deposition (CVD) reactor chamber, and the flow and temperature fields inside the reactor chamber are analyzed. Factors influencing the uniformity of flow field distribution include the reactant gas distribution and the gas-inlet tunnel’s diameter and position. The flow field uniformity is represented by the relative standard deviation of the velocity. Parameters impacting the temperature field uniformity include the position and pitch of the heating coil and the graphite column width. The heating efficiency of the substrate and temperature uniformity are expressed by the average temperature and standard deviation of the temperature, respectively. Support vector machine (SVM) is used to establish the relationship between design variables and the objective function, and the multi-objective particle swarm optimization (MOPSO) algorithm is used to optimize the reactor. The proposed approach improves the uniformity of the flow and temperature fields and the heating efficiency of the substrate.
Original languageEnglish
Title of host publicationInternational Conference on (ICEPT) Electronic Packaging Technology
PublisherIEEE
Number of pages7
ISBN (Electronic)979-8-3503-3881-2
ISBN (Print)979-8-3503-3882-9
DOIs
Publication statusPublished - 2023
Event24th International Conference on Electronic Packaging Technology, ICEPT 2023 - Shihezi City, China
Duration: 8 Aug 202311 Aug 2023

Conference

Conference24th International Conference on Electronic Packaging Technology, ICEPT 2023
Country/TerritoryChina
CityShihezi City
Period8/08/2311/08/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • Epitaxial growth
  • MOPSO
  • Multi-objective optimization
  • Silicon carbide
  • SVM

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