Outgassing of Materials Used for Thin Film Vacuum Packages

Q Li, JFL Goosen, JTM van Beek, F van Keulen, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

12 Citations (Scopus)

Abstract

In this paper, outgassing of the thin film vacuum package is analyzed by integrated MEMS (Microelectromechanical system) resonator and RBS (Rutherford backscattering spectroscopy). Outgassing behavior of different thin film packaging materials is studied by exodiffusion experiments. It is demonstrated that a high temperature pre anneal will greatly reduce the outgassing but can not eliminate it.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 10-13 August 2009, Beijing, China
Editors Xu, J., Cai, J., Wan, L., Shi, D.
PublisherIEEE Society
Pages802-806
Number of pages5
ISBN (Print)978-1-4244-4659-9
Publication statusPublished - 2009

Publication series

Name
PublisherIEEE

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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