In this paper, outgassing of the thin film vacuum package is analyzed by integrated MEMS (Microelectromechanical system) resonator and RBS (Rutherford backscattering spectroscopy). Outgassing behavior of different thin film packaging materials is studied by exodiffusion experiments. It is demonstrated that a high temperature pre anneal will greatly reduce the outgassing but can not eliminate it.
|Title of host publication||Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 10-13 August 2009, Beijing, China|
|Editors|| Xu, J., Cai, J., Wan, L., Shi, D.|
|Number of pages||5|
|Publication status||Published - 2009|
- conference contrib. refereed
- Conf.proc. > 3 pag