@inproceedings{59688834897443f6afc14dea2bab599c,
title = "Outgassing of Materials Used for Thin Film Vacuum Packages",
abstract = "In this paper, outgassing of the thin film vacuum package is analyzed by integrated MEMS (Microelectromechanical system) resonator and RBS (Rutherford backscattering spectroscopy). Outgassing behavior of different thin film packaging materials is studied by exodiffusion experiments. It is demonstrated that a high temperature pre anneal will greatly reduce the outgassing but can not eliminate it.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "Q Li and JFL Goosen and {van Beek}, JTM and {van Keulen}, F and GQ Zhang",
year = "2009",
language = "Undefined/Unknown",
isbn = "978-1-4244-4659-9",
publisher = "IEEE",
pages = "802--806",
editor = "{Xu, J.} and {Cai, J.} and {Wan, L.} and {Shi, D.}",
booktitle = "Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 10-13 August 2009, Beijing, China",
address = "United States",
}