Abstract
The future of reliability is bright as each electronics company is spending 1–5% of their annual sales on cost of non-quality. These costs are related to product failures prior to the end of its warranty period. If even a portion of these costs are reduced, it would result in a substantial profit increase. Progress in the area of reliability can be found in five directions; (i) multi-scale and multi-physics simulations for physics of degradation; (ii) AI-based control systems in advanced production; (iii) smart sensoring and big data analysis; (iv) reliable materials and reliability testing; and (v) prognostics and health management/digital twin for condition monitoring. In this chapter, we discuss these directions and what it would mean for the future developments of the reliability domain.
| Original language | English |
|---|---|
| Title of host publication | Recent Advances in Microelectronics Reliability |
| Subtitle of host publication | Contributions from the European ECSEL JU Project iRel40 |
| Publisher | Springer |
| Pages | 385-400 |
| Number of pages | 16 |
| ISBN (Electronic) | 9783031593611 |
| ISBN (Print) | 9783031593604 |
| DOIs | |
| Publication status | Published - 2024 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.