Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

Hongyu Tang, Huaiyu Ye, Cell K.Y. Wong, Stanley Y.Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

2 Citations (Scopus)
16 Downloads (Pure)

Abstract

The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the impact of various components, including blue die, phosphor layer, and substrate, on the lumen depreciation of CSP LEDs after aging test. The electro-optical measurement results show that the overdriving current can lead to both massive light output degradation and significant color shift of CSP LEDs. The quantitative analysis results show that the phosphor layer is the major contributor to the failure in early period aging test. For the long-term reliability, the degradations of phosphor and reflectivity of substrate contribute significantly on lumen depreciation. The proposed reliability assessment method with overdriving loadings can be usefully implemented for LED manufacturers to make a cost- and effective-decision before mass production.

Original languageEnglish
Pages (from-to)197-204
Number of pages8
JournalMicroelectronics Reliability
Volume78
DOIs
Publication statusPublished - 2017

Bibliographical note

Accepted author manuscript

Keywords

  • Chip scale package
  • Component impact
  • Light emitting diodes
  • Overdriving reliability

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