Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies

M Cannavo, HW van Zeijl, G Pandraud, JV Driel, T Alan, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationSAFE 2007 Semiconductor advances for future electornics
Editors s.n.
Place of PublicationVeldhoven, The Netherlands
PublisherSTW
Pages509-512
Number of pages4
ISBN (Print)978-90-73461-49-9
Publication statusPublished - 2007

Publication series

Name
PublisherSTW

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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