@inproceedings{248076064bd74670ac845596404eee70,
title = "Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "M Cannavo and {van Zeijl}, HW and G Pandraud and JV Driel and T Alan and PM Sarro",
year = "2007",
language = "Undefined/Unknown",
isbn = "978-90-73461-49-9",
publisher = "STW",
pages = "509--512",
editor = "s.n.",
booktitle = "SAFE 2007 Semiconductor advances for future electornics",
}