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Oxygen-plasma-based digital etching for gan/algan high electron mobility transistors

Jingyi Wu, Hongyu Yu, Yang Jiang, Zeyu Wan, Siqi Lei, Wei Chih Cheng, Guangnan Zhou, Robert Sokolovskij, Qing Wang, Guangrui Maggie Xia

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Digital etching is an effective method to lower dry etch damages in A1GaN/GaN HEMTs. This work systematically investigated O2-plasma-based digital etching of AlGaN and p-GaN. AlN layers were used as the etch stop layers in the AlGaN etch. Important process aspects such as the use of the AlN layers, the RF power, the oxygen flow rate, the oxidation time and the resulting roughness were studied. These are technically relevant to obtain controllable, uniform etch surfaces with low surface damages for better HEMT performance.

Original languageEnglish
Title of host publicationProceedings - 2019 IEEE 13th International Conference on ASIC, ASICON 2019
EditorsFan Ye, Ting-Ao Tang
PublisherIEEE
ISBN (Electronic)9781728107356
DOIs
Publication statusPublished - 2019
Event13th IEEE International Conference on ASIC, ASICON 2019 - Chongqing, China
Duration: 29 Oct 20191 Nov 2019

Publication series

NameProceedings of International Conference on ASIC
ISSN (Print)2162-7541
ISSN (Electronic)2162-755X

Conference

Conference13th IEEE International Conference on ASIC, ASICON 2019
Country/TerritoryChina
CityChongqing
Period29/10/191/11/19

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