Packaging induced die stresses considering time-dependent behaviour of a molding compound

JHJ Janssen, G.Q. Zhang, LJ Ernst, MS Kiasat, ? et al

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Original languageUndefined/Unknown
Title of host publicationProceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11
Editors LJ Ernst, de O Saint Leger, GQ Zhang
Place of PublicationParis
PublisherEuropia
Pages227-231
Number of pages5
ISBN (Print)0-7803-9806-8
Publication statusPublished - 2001
EventEuroSimE 2001 - Paris, France
Duration: 9 Apr 200111 Apr 2001

Publication series

Name
PublisherEuropia

Conference

ConferenceEuroSimE 2001
CountryFrance
CityParis
Period9/04/0111/04/01

Keywords

  • ZX Int.klas.verslagjaar < 2002

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