Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

WD van Driel, JHJ Janssen, GQ Zhang, LJ Ernst, DG Yang

Research output: Contribution to journalArticleScientificpeer-review

49 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)520-526
Number of pages7
JournalJournal of Electronic Packaging
Issue number4
Publication statusPublished - 2003


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