Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	520-526
Number of pages	7
Journal	Journal of Electronic Packaging
Volume	125
Issue number	4
Publication status	Published - 2003

Keywords

@article{b42e05090f894277ab100ccec4cde311,

title = "Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound",

keywords = "ZX CWTS 1.00 <= JFIS < 3.00",

author = "\{van Driel\}, WD and JHJ Janssen and GQ Zhang and LJ Ernst and DG Yang",

year = "2003",

language = "Undefined/Unknown",

volume = "125",

pages = "520--526",

journal = "Journal of Electronic Packaging",

issn = "1043-7398",

publisher = "American Society of Mechanical Engineers (ASME)",

number = "4",

}

TY - JOUR

T1 - Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

AU - van Driel, WD

AU - Janssen, JHJ

AU - Zhang, GQ

AU - Ernst, LJ

AU - Yang, DG

PY - 2003

Y1 - 2003

KW - ZX CWTS 1.00 <= JFIS < 3.00

M3 - Article

SN - 1043-7398

VL - 125

SP - 520

EP - 526

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

IS - 4

ER -