Packaging of an integrated planar power passive module for a power electronics converter: a 1 MHz case study

JT Strydom, JD van Wyk, CK Campbell, JA Ferreira, MFK Holm

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	260-265
Number of pages	6
Journal	IEEE Transactions on Components and Packaging Technology
Volume	25
Issue number	2
Publication status	Published - 2002

Keywords

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title = "Packaging of an integrated planar power passive module for a power electronics converter: a 1 MHz case study",

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author = "JT Strydom and {van Wyk}, JD and CK Campbell and JA Ferreira and MFK Holm",

year = "2002",

language = "Undefined/Unknown",

volume = "25",

pages = "260--265",

journal = "IEEE Transactions on Components and Packaging Technology",

issn = "1521-3331",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

number = "2",

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T1 - Packaging of an integrated planar power passive module for a power electronics converter: a 1 MHz case study

AU - Strydom, JT

AU - van Wyk, JD

AU - Campbell, CK

AU - Ferreira, JA

AU - Holm, MFK

PY - 2002

Y1 - 2002

KW - ZX Nader te bep. ivm conversie

M3 - Article

VL - 25

SP - 260

EP - 265

JO - IEEE Transactions on Components and Packaging Technology

JF - IEEE Transactions on Components and Packaging Technology

SN - 1521-3331

IS - 2

ER -