Packaging of an integrated planar power passive module for a power electronics converter: a 1 MHz case study

JT Strydom, JD van Wyk, CK Campbell, JA Ferreira, MFK Holm

    Research output: Contribution to journalArticleScientificpeer-review

    6 Citations (Scopus)
    Original languageUndefined/Unknown
    Pages (from-to)260-265
    Number of pages6
    JournalIEEE Transactions on Components and Packaging Technology
    Issue number2
    Publication statusPublished - 2002


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