Packaging Technologies for Single-Side Cooling SiC Power Modules With Low Parasitic Inductance: A Review
- Keyvan Yari
- , Alireza Mehrabi
- , René H. Poelma
- , Sijun Du*
- , Willem D. van Driel*
- , Guo Qi Zhang*
*Corresponding author for this work
Research output: Contribution to journal › Review article › peer-review
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