Parameter calibration on post-implantation dopant diffusion

J Fu, W Crans, WJ Eysenga

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationEuroSIME 2004; Proceedings of the Fifth international conference on thermal and mechanical simulation and experiments in micro-electronics and micro-systems
EditorsLJ Ernst, GQ Zhang, P Rodgers, O de Siant Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages191-198
Number of pages8
ISBN (Print)0-7803-8420-2
Publication statusPublished - 2004
EventFifth international conference on thermal and mechanical simulation and experiments in micro-electronics and micro-systems, Brussels, Belgium - Piscataway
Duration: 10 May 200412 May 2004

Publication series

Name
PublisherIEEE

Conference

ConferenceFifth international conference on thermal and mechanical simulation and experiments in micro-electronics and micro-systems, Brussels, Belgium
Period10/05/0412/05/04

Keywords

  • Elektrotechniek
  • Techniek
  • Conf.proc. > 3 pag

Cite this

Fu, J., Crans, W., & Eysenga, WJ. (2004). Parameter calibration on post-implantation dopant diffusion. In LJ. Ernst, GQ. Zhang, P. Rodgers, & O. de Siant Leger (Eds.), EuroSIME 2004; Proceedings of the Fifth international conference on thermal and mechanical simulation and experiments in micro-electronics and micro-systems (pp. 191-198). IEEE Society.