Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

DG Yang, JS Liang, QY Li, LJ Ernst, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

17 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)1947-1955
Number of pages9
JournalMicroelectronics Reliability
Publication statusPublished - 2004


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