Parasitic effects reduction for wafer-level packaging of RF-MEMS

J Iannacci; J Tian; SM Sinaga; R Gaddi; A Gnudi; M Bartek

Parasitic effects reduction for wafer-level packaging of RF-MEMS

J Iannacci, J Tian, SM Sinaga, R Gaddi, A Gnudi, M Bartek

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proc. Symposium on Design, Test, integration and Packaging of MEMS/MOEMS (DTIP 2006)
Editors	n.s.
Place of Publication	s.l.
Publisher	TIMA
Pages	1-6
Number of pages	6
ISBN (Print)	2-916187-03-0
Publication status	Published - 2006
Event	Symposium on Design, Test, integration and Packaging of MEMS/MOEMS (DTIP 2006), Stresa, Italy. - s.l. Duration: 26 Apr 2006 → 28 Apr 2006

Publication series

Name
Publisher	TIMA

Conference

Conference	Symposium on Design, Test, integration and Packaging of MEMS/MOEMS (DTIP 2006), Stresa, Italy.
Period	26/04/06 → 28/04/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{157e241282cd44a5a82e011db31cde91,

title = "Parasitic effects reduction for wafer-level packaging of RF-MEMS",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J Iannacci and J Tian and SM Sinaga and R Gaddi and A Gnudi and M Bartek",

year = "2006",

language = "Undefined/Unknown",

isbn = "2-916187-03-0",

publisher = "TIMA",

pages = "1--6",

editor = "n.s.",

booktitle = "Proc. Symposium on Design, Test, integration and Packaging of MEMS/MOEMS (DTIP 2006)",

note = "null ; Conference date: 26-04-2006 Through 28-04-2006",

}

Parasitic effects reduction for wafer-level packaging of RF-MEMS. / Iannacci, J; Tian, J; Sinaga, SM; Gaddi, R; Gnudi, A; Bartek, M.

Proc. Symposium on Design, Test, integration and Packaging of MEMS/MOEMS (DTIP 2006). ed. / n.s. s.l. : TIMA, 2006. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Parasitic effects reduction for wafer-level packaging of RF-MEMS

AU - Iannacci, J

AU - Tian, J

AU - Sinaga, SM

AU - Gaddi, R

AU - Gnudi, A

AU - Bartek, M

PY - 2006

Y1 - 2006

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 2-916187-03-0

SP - 1

EP - 6

BT - Proc. Symposium on Design, Test, integration and Packaging of MEMS/MOEMS (DTIP 2006)

A2 - n.s., null

PB - TIMA

CY - s.l.

Y2 - 26 April 2006 through 28 April 2006

ER -