Parylene-embedded metal interconnects for stretchable silicon electronics

T Zoumpoulidis, M Bartek, R Dekker

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proc. International Conference on Electronics Packaging (ICEP 2009)
Editors	s.n.
Place of Publication	Kyoto, Japan
Publisher	JIEP, IEEE
Pages	611-615
Number of pages	5
Publication status	Published - 2009
Event	ICEP 2009 - Kyoto, Japan Duration: 14 Apr 2009 → 16 Apr 2009

Name
Publisher	JIEP, IEEE

Conference	ICEP 2009
Period	14/04/09 → 16/04/09

Keywords

@inproceedings{ecb28ec4cc8e437fa89126a4e793c39f,

title = "Parylene-embedded metal interconnects for stretchable silicon electronics",

keywords = "Conf.proc. > 3 pag",

author = "T Zoumpoulidis and M Bartek and R Dekker",

year = "2009",

language = "Undefined/Unknown",

publisher = "JIEP, IEEE",

pages = "611--615",

editor = "s.n.",

booktitle = "Proc. International Conference on Electronics Packaging (ICEP 2009)",

note = "ICEP 2009 ; Conference date: 14-04-2009 Through 16-04-2009",

}

TY - GEN

T1 - Parylene-embedded metal interconnects for stretchable silicon electronics

AU - Zoumpoulidis, T

AU - Bartek, M

AU - Dekker, R

PY - 2009

Y1 - 2009

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 611

EP - 615

BT - Proc. International Conference on Electronics Packaging (ICEP 2009)

A2 - s.n., null

PB - JIEP, IEEE

CY - Kyoto, Japan

T2 - ICEP 2009

Y2 - 14 April 2009 through 16 April 2009

ER -