Passive Intermodulation Due to Conductor Surface Roughness

Paolo Ansuinelli; Alexander G. Schuchinsky; Fabrizio Frezza; Michael B. Steer

doi:10.1109/TMTT.2017.2784817

Passive Intermodulation Due to Conductor Surface Roughness

Paolo Ansuinelli, Alexander G. Schuchinsky^*, Fabrizio Frezza, Michael B. Steer

^*Corresponding author for this work

ImPhys/Optics

Research output: Contribution to journal › Article › Scientific › peer-review

33 Citations (Scopus)

22 Downloads (Pure)

Abstract

The physical mechanism of the experimentally observed dependence of passive intermodulation (PIM) in printed circuits on conductor surface roughness is studied. It is shown that electrothermal (ET) nonlinearity, arising due to heating of imperfect conductors by high-power carriers in a multicarrier system, is correlated with conductor surface roughness and has a unique signature. Carriers modulate the conductor resistivity, skin depth, and surface impedance which generate PIM products. The detailed analysis demonstrates that ET-PIM depends on the conductor resistivity, shape, and roughness profile and also on the electric and thermal properties of the substrate. Their effects on PIM are illustrated by examples of uniform microstrip lines with different conductor and substrate materials, and periodically perturbed and meandered microstrip lines.

Original language	English
Article number	8248671
Pages (from-to)	688-699
Number of pages	12
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	66
Issue number	2
DOIs	https://doi.org/10.1109/TMTT.2017.2784817
Publication status	Published - 2018

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

conductor losses
electrothermal (ET) nonlinearity
microstrip line
nonlinear resistivity
passive intermodulation (PIM)
surface roughness

Access to Document

10.1109/TMTT.2017.2784817

Passive_Intermodulation_Due_to_Conductor_Surface_RoughnessFinal published version, 2.44 MB

Cite this

@article{b2379f2b035d4b45941c7340a972dcdf,

title = "Passive Intermodulation Due to Conductor Surface Roughness",

abstract = "The physical mechanism of the experimentally observed dependence of passive intermodulation (PIM) in printed circuits on conductor surface roughness is studied. It is shown that electrothermal (ET) nonlinearity, arising due to heating of imperfect conductors by high-power carriers in a multicarrier system, is correlated with conductor surface roughness and has a unique signature. Carriers modulate the conductor resistivity, skin depth, and surface impedance which generate PIM products. The detailed analysis demonstrates that ET-PIM depends on the conductor resistivity, shape, and roughness profile and also on the electric and thermal properties of the substrate. Their effects on PIM are illustrated by examples of uniform microstrip lines with different conductor and substrate materials, and periodically perturbed and meandered microstrip lines.",

keywords = "conductor losses, electrothermal (ET) nonlinearity, microstrip line, nonlinear resistivity, passive intermodulation (PIM), surface roughness",

author = "Paolo Ansuinelli and Schuchinsky, \{Alexander G.\} and Fabrizio Frezza and Steer, \{Michael B.\}",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.",

year = "2018",

doi = "10.1109/TMTT.2017.2784817",

language = "English",

volume = "66",

pages = "688--699",

journal = "IEEE Transactions on Microwave Theory and Techniques",

issn = "0018-9480",

publisher = "IEEE",

number = "2",

}

TY - JOUR

T1 - Passive Intermodulation Due to Conductor Surface Roughness

AU - Ansuinelli, Paolo

AU - Schuchinsky, Alexander G.

AU - Frezza, Fabrizio

AU - Steer, Michael B.

N1 - Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

PY - 2018

Y1 - 2018

N2 - The physical mechanism of the experimentally observed dependence of passive intermodulation (PIM) in printed circuits on conductor surface roughness is studied. It is shown that electrothermal (ET) nonlinearity, arising due to heating of imperfect conductors by high-power carriers in a multicarrier system, is correlated with conductor surface roughness and has a unique signature. Carriers modulate the conductor resistivity, skin depth, and surface impedance which generate PIM products. The detailed analysis demonstrates that ET-PIM depends on the conductor resistivity, shape, and roughness profile and also on the electric and thermal properties of the substrate. Their effects on PIM are illustrated by examples of uniform microstrip lines with different conductor and substrate materials, and periodically perturbed and meandered microstrip lines.

AB - The physical mechanism of the experimentally observed dependence of passive intermodulation (PIM) in printed circuits on conductor surface roughness is studied. It is shown that electrothermal (ET) nonlinearity, arising due to heating of imperfect conductors by high-power carriers in a multicarrier system, is correlated with conductor surface roughness and has a unique signature. Carriers modulate the conductor resistivity, skin depth, and surface impedance which generate PIM products. The detailed analysis demonstrates that ET-PIM depends on the conductor resistivity, shape, and roughness profile and also on the electric and thermal properties of the substrate. Their effects on PIM are illustrated by examples of uniform microstrip lines with different conductor and substrate materials, and periodically perturbed and meandered microstrip lines.

KW - conductor losses

KW - electrothermal (ET) nonlinearity

KW - microstrip line

KW - nonlinear resistivity

KW - passive intermodulation (PIM)

KW - surface roughness

UR - https://www.scopus.com/pages/publications/85040543512

U2 - 10.1109/TMTT.2017.2784817

DO - 10.1109/TMTT.2017.2784817

M3 - Article

AN - SCOPUS:85040543512

SN - 0018-9480

VL - 66

SP - 688

EP - 699

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

IS - 2

M1 - 8248671

ER -

Passive Intermodulation Due to Conductor Surface Roughness

Abstract

Bibliographical note

Keywords

Access to Document

Other files and links

Fingerprint

Cite this