@inproceedings{255eb9bef30c48a38ba236c23c19d83f,
title = "Photonic hybrid assembly through flexible waveguides",
abstract = "Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.",
keywords = "Eutectic bonding, Flip-chip, InP, LTCC, MEMS, Photonic assembly, Photonic integrated circuit, TriPleX",
author = "Kerstin W{\"o}rhoff and Albert Prak and F. Postma and A Leinse and Kai Wu and Peters, {T. J.} and M. Tichem and B. Amaning-Appiah and V. Renukappa and G. Vollrath and J. Balcells-Ventura and P. Uhlig and M. Seyfried and D. Rose and Raquel Santos and Leijtens, {X. J.M.} and B. Flintham and M. Wale and D. Robbins",
year = "2016",
doi = "10.1117/12.2227814",
language = "English",
volume = "9891",
series = "Proceedings of SPIE",
publisher = "SPIE",
editor = "Laurent Vivien and Lorenzo Pavesi and Stefano Pelli",
booktitle = "Proceedings Silicon Photonics and Photonic Integrated Circuits V",
address = "United States",
note = "Silicon Photonics and Photonic Integrated Circuits V ; Conference date: 03-04-2016 Through 07-04-2016",
}