TY - GEN
T1 - Photonic Motherboard
T2 - 2025 Conference on Lasers and Electro-Optics, CLEO 2025
AU - Magalhães, Letícia S.
AU - Witt, Donald
AU - Shams-Ansari, Amirhassan
AU - Rajabali, Shima
AU - Assumpcao, Daniel
AU - Zhu, Xinrui
AU - Warner, Hana K.
AU - Yeh, Matthew
AU - Hu, Yaowen
AU - More Authors, null
N1 - Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
PY - 2025
Y1 - 2025
N2 - We present a photonic integration method combining flip-chip bonding and photonic wirebonding. This approach enables a 'mother' substrate to host 'child' chips from diverse platforms, fostering seamless integration for multi-functional photonic architectures.
AB - We present a photonic integration method combining flip-chip bonding and photonic wirebonding. This approach enables a 'mother' substrate to host 'child' chips from diverse platforms, fostering seamless integration for multi-functional photonic architectures.
UR - http://www.scopus.com/inward/record.url?scp=105021463077&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:105021463077
T3 - 2025 Conference on Lasers and Electro-Optics, CLEO 2025
BT - 2025 Conference on Lasers and Electro-Optics, CLEO 2025
PB - IEEE
Y2 - 4 May 2025 through 9 May 2025
ER -