Abstract
The ability to accurately predict the reliability and lifetime of electronics is of great importance to the industry. The failure of the solder joint is of particular interest for these predictions, because of their susceptibility to failure under thermo-mechanical stress. However, the experimental or even conventional simulation techniques employed to estimate the lifetime of a solder joint are often too expensive or time consuming to be of practical use. Therefore, this work introduces a physics-informed Long Short-Term Memory (LSTM) to predict the plastic strain in the critical area of the solder joint. The predicted values are in agreement with the values gained from finite elements, thereby demonstrating the advantage of applying the proposed methodology.
Original language | English |
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Title of host publication | Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
Publisher | IEEE |
Number of pages | 7 |
ISBN (Electronic) | 979-8-3503-9363-7 |
ISBN (Print) | 979-8-3503-9364-4 |
DOIs | |
Publication status | Published - 2024 |
Event | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Catania, Italy Duration: 7 Apr 2024 → 10 Apr 2024 Conference number: 25th |
Publication series
Name | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
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Conference
Conference | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
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Abbreviated title | EuriSimE 2024 |
Country/Territory | Italy |
City | Catania |
Period | 7/04/24 → 10/04/24 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- Solder Joint Reliability
- Plasticity
- Finite Elements
- PINN
- LSTM