Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications

SBS Heil; E Langereis; F Roozeboom; A Kemmeren; NP Pham; PM Sarro; MCM van de Sanden; WMM Kessels

Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications

SBS Heil, E Langereis, F Roozeboom, A Kemmeren, NP Pham, PM Sarro, MCM van de Sanden, WMM Kessels

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Materials, Technology and Reliability of Advanced Interconnects 2005
Editors	PR Besser, AJ McKerrow, F Iacopi, CP Wong, J Vlassak
Place of Publication	Warrendale
Publisher	Materials Research Society
Pages	B6.4.1-B6.4.6
Publication status	Published - 2005
Event	MRS Spring meeting 2005, San Francisco - Warrendale Duration: 28 Mar 2005 → 1 Apr 2005

Publication series

Name
Publisher	Materials Research Society

Name	Materials Research Society Symposium Proceedings
Volume	863
ISSN (Print)	0272-9172

Conference

Conference	MRS Spring meeting 2005, San Francisco
Period	28/03/05 → 1/04/05

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Heil, SBS., Langereis, E., Roozeboom, F., Kemmeren, A., Pham, NP., Sarro, PM., van de Sanden, MCM., & Kessels, WMM. (2005). Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. In PR. Besser, AJ. McKerrow, F. Iacopi, CP. Wong, & J. Vlassak (Eds.), Materials, Technology and Reliability of Advanced Interconnects 2005 (pp. B6.4.1-B6.4.6). (Materials Research Society Symposium Proceedings; Vol. 863). Materials Research Society.

Heil, SBS ; Langereis, E ; Roozeboom, F et al. / Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. Materials, Technology and Reliability of Advanced Interconnects 2005. editor / PR Besser ; AJ McKerrow ; F Iacopi ; CP Wong ; J Vlassak. Warrendale : Materials Research Society, 2005. pp. B6.4.1-B6.4.6 (Materials Research Society Symposium Proceedings).

@inproceedings{8f646a12290d49b1b3e13d72f06d2412,

title = "Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "SBS Heil and E Langereis and F Roozeboom and A Kemmeren and NP Pham and PM Sarro and {van de Sanden}, MCM and WMM Kessels",

year = "2005",

language = "Undefined/Unknown",

publisher = "Materials Research Society",

pages = "B6.4.1--B6.4.6",

editor = "PR Besser and AJ McKerrow and F Iacopi and CP Wong and J Vlassak",

booktitle = "Materials, Technology and Reliability of Advanced Interconnects 2005",

address = "United States",

note = "MRS Spring meeting 2005, San Francisco ; Conference date: 28-03-2005 Through 01-04-2005",

}

Heil, SBS, Langereis, E, Roozeboom, F, Kemmeren, A, Pham, NP, Sarro, PM, van de Sanden, MCM & Kessels, WMM 2005, Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. in PR Besser, AJ McKerrow, F Iacopi, CP Wong & J Vlassak (eds), Materials, Technology and Reliability of Advanced Interconnects 2005. Materials Research Society Symposium Proceedings, vol. 863, Materials Research Society, Warrendale, pp. B6.4.1-B6.4.6, MRS Spring meeting 2005, San Francisco, 28/03/05.

Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. / Heil, SBS; Langereis, E; Roozeboom, F et al.
Materials, Technology and Reliability of Advanced Interconnects 2005. ed. / PR Besser; AJ McKerrow; F Iacopi; CP Wong; J Vlassak. Warrendale: Materials Research Society, 2005. p. B6.4.1-B6.4.6 (Materials Research Society Symposium Proceedings; Vol. 863).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications

AU - Heil, SBS

AU - Langereis, E

AU - Roozeboom, F

AU - Kemmeren, A

AU - Pham, NP

AU - Sarro, PM

AU - van de Sanden, MCM

AU - Kessels, WMM

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - B6.4.1-B6.4.6

BT - Materials, Technology and Reliability of Advanced Interconnects 2005

A2 - Besser, PR

A2 - McKerrow, AJ

A2 - Iacopi, F

A2 - Wong, CP

A2 - Vlassak, J

PB - Materials Research Society

CY - Warrendale

T2 - MRS Spring meeting 2005, San Francisco

Y2 - 28 March 2005 through 1 April 2005

ER -

Heil SBS, Langereis E, Roozeboom F, Kemmeren A, Pham NP, Sarro PM et al. Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. In Besser PR, McKerrow AJ, Iacopi F, Wong CP, Vlassak J, editors, Materials, Technology and Reliability of Advanced Interconnects 2005. Warrendale: Materials Research Society. 2005. p. B6.4.1-B6.4.6. (Materials Research Society Symposium Proceedings).