Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

J Tang; H Ye; JBJ Schelen; CIM Beenakker

doi:10.1109/ICEPT.2011.6066972

Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

J Tang, H Ye, JBJ Schelen, CIM Beenakker

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

10 Citations (Scopus)

Original language	English
Title of host publication	12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011)
Editors	s.n.
Place of Publication	Shanghai, China
Publisher	IEEE
Pages	888-892
Number of pages	5
ISBN (Print)	978-1-4577-1770-3
DOIs	https://doi.org/10.1109/ICEPT.2011.6066972
Publication status	Published - 2011
Event	12th ICEPT-HDP 2011 - Shanghai, China Duration: 8 Aug 2011 → 11 Aug 2011

Publication series

Name
Publisher	IEEE

Conference

Conference	12th ICEPT-HDP 2011
Period	8/08/11 → 11/08/11

Keywords

Conf.proc. > 3 pag

Access to Document

10.1109/ICEPT.2011.6066972

Cite this

@inproceedings{ed4fbdfd7113475c8359c86786f4b3c0,

title = "Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis",

keywords = "Conf.proc. > 3 pag",

author = "J Tang and H Ye and JBJ Schelen and CIM Beenakker",

year = "2011",

doi = "10.1109/ICEPT.2011.6066972",

language = "English",

isbn = "978-1-4577-1770-3",

publisher = "IEEE",

pages = "888--892",

editor = "s.n.",

booktitle = "12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011)",

address = "United States",

note = "12th ICEPT-HDP 2011 ; Conference date: 08-08-2011 Through 11-08-2011",

}

Tang, J , Ye, H, Schelen, JBJ & Beenakker, CIM 2011, Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis. in s.n. (ed.), 12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011). IEEE, Shanghai, China, pp. 888-892, 12th ICEPT-HDP 2011, 8/08/11. https://doi.org/10.1109/ICEPT.2011.6066972

Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis. / Tang, J ; Ye, H; Schelen, JBJ et al.
12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011). ed. / s.n. Shanghai, China: IEEE, 2011. p. 888-892.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

AU - Tang, J

AU - Ye, H

AU - Schelen, JBJ

AU - Beenakker, CIM

PY - 2011

Y1 - 2011

KW - Conf.proc. > 3 pag

U2 - 10.1109/ICEPT.2011.6066972

DO - 10.1109/ICEPT.2011.6066972

M3 - Conference contribution

SN - 978-1-4577-1770-3

SP - 888

EP - 892

BT - 12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011)

A2 - s.n., null

PB - IEEE

CY - Shanghai, China

T2 - 12th ICEPT-HDP 2011

Y2 - 8 August 2011 through 11 August 2011

ER -