Plasma etching for failure analysis of integrated circuit packages

J Tang; JBJ Schelen; CIM Beenakker

doi:10.1149/1.3567691

Plasma etching for failure analysis of integrated circuit packages

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	China Semiconductor Technology International Conference 2011 (CSTIC 2011)
Editors	H Wu, Q Lin
Place of Publication	Shanghai, China
Publisher	ECS
Pages	913-918
Number of pages	6
DOIs	https://doi.org/10.1149/1.3567691
Publication status	Published - 2011
Event	China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China Duration: 18 Mar 2011 → 19 Mar 2011

Publication series

Name
Publisher	ECS

Name	ECS Transactions
Volume	34
ISSN (Print)	1938-5862

Conference

Conference	China Semiconductor Technology International Conference 2011 (CSTIC 2011)
Period	18/03/11 → 19/03/11

Keywords

Conf.proc. > 3 pag

Access to Document

10.1149/1.3567691

Cite this

@inproceedings{4c0cbb46c54746e6aed66c8136c75b8f,

title = "Plasma etching for failure analysis of integrated circuit packages",

keywords = "Conf.proc. > 3 pag",

author = "J Tang and JBJ Schelen and CIM Beenakker",

year = "2011",

doi = "10.1149/1.3567691",

language = "English",

publisher = "ECS",

pages = "913--918",

editor = "H Wu and Q Lin",

booktitle = "China Semiconductor Technology International Conference 2011 (CSTIC 2011)",

note = "China Semiconductor Technology International Conference 2011 (CSTIC 2011) ; Conference date: 18-03-2011 Through 19-03-2011",

}

Tang, J, Schelen, JBJ & Beenakker, CIM 2011, Plasma etching for failure analysis of integrated circuit packages. in H Wu & Q Lin (eds), China Semiconductor Technology International Conference 2011 (CSTIC 2011). ECS Transactions, vol. 34, ECS, Shanghai, China, pp. 913-918, China Semiconductor Technology International Conference 2011 (CSTIC 2011), 18/03/11. https://doi.org/10.1149/1.3567691

Plasma etching for failure analysis of integrated circuit packages. / Tang, J; Schelen, JBJ; Beenakker, CIM.
China Semiconductor Technology International Conference 2011 (CSTIC 2011). ed. / H Wu; Q Lin. Shanghai, China: ECS, 2011. p. 913-918 (ECS Transactions; Vol. 34).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Plasma etching for failure analysis of integrated circuit packages

AU - Tang, J

AU - Schelen, JBJ

AU - Beenakker, CIM

PY - 2011

Y1 - 2011

KW - Conf.proc. > 3 pag

U2 - 10.1149/1.3567691

DO - 10.1149/1.3567691

M3 - Conference contribution

SP - 913

EP - 918

BT - China Semiconductor Technology International Conference 2011 (CSTIC 2011)

A2 - Wu, H

A2 - Lin, Q

PB - ECS

CY - Shanghai, China

T2 - China Semiconductor Technology International Conference 2011 (CSTIC 2011)

Y2 - 18 March 2011 through 19 March 2011

ER -