Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

CA Yuan; J Wei; H Ye; SW Koh; S Harianto; M van den Nieuwenhof; GQ Zhang

doi:10.1109/ESimE.2012.6191808

Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

CA Yuan, J Wei, H Ye, SW Koh, S Harianto, M van den Nieuwenhof, GQ Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Editors	O De Saint Leger et al
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	712-718
Number of pages	7
ISBN (Print)	978-1-4673-1512-8
DOIs	https://doi.org/10.1109/ESimE.2012.6191808
Publication status	Published - 2012
Event	EuroSimE 2012: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Lisbon, Portugal Duration: 16 Apr 2012 → 18 Apr 2012 Conference number: 13

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2012
Country/Territory	Portugal
City	Lisbon
Period	16/04/12 → 18/04/12

Bibliographical note

Harvest
Article number: 6191808

Access to Document

10.1109/ESimE.2012.6191808

Cite this

Yuan, CA., Wei, J., Ye, H., Koh, SW., Harianto, S., van den Nieuwenhof, M., & Zhang, GQ. (2012). Polymer-based 2D/3D wafer level heterogeneous integration for SSL module. In O. De Saint Leger et al (Ed.), Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (pp. 712-718). IEEE. https://doi.org/10.1109/ESimE.2012.6191808

@inproceedings{0aeebfcbc305433cb1d8132c58775236,

title = "Polymer-based 2D/3D wafer level heterogeneous integration for SSL module",

author = "CA Yuan and J Wei and H Ye and SW Koh and S Harianto and {van den Nieuwenhof}, M and GQ Zhang",

note = "Harvest Article number: 6191808; EuroSimE 2012 : 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 16-04-2012 Through 18-04-2012",

year = "2012",

doi = "10.1109/ESimE.2012.6191808",

language = "English",

isbn = "978-1-4673-1512-8",

publisher = "IEEE",

pages = "712--718",

editor = "{De Saint Leger et al}, O",

booktitle = "Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

address = "United States",

}

Yuan, CA, Wei, J, Ye, H, Koh, SW, Harianto, S, van den Nieuwenhof, M & Zhang, GQ 2012, Polymer-based 2D/3D wafer level heterogeneous integration for SSL module. in O De Saint Leger et al (ed.), Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. IEEE, Piscataway, NJ, USA, pp. 712-718, EuroSimE 2012, Lisbon, Portugal, 16/04/12. https://doi.org/10.1109/ESimE.2012.6191808

Polymer-based 2D/3D wafer level heterogeneous integration for SSL module. / Yuan, CA; Wei, J; Ye, H et al.
Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. ed. / O De Saint Leger et al. Piscataway, NJ, USA: IEEE, 2012. p. 712-718.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

AU - Yuan, CA

AU - Wei, J

AU - Ye, H

AU - Koh, SW

AU - Harianto, S

AU - van den Nieuwenhof, M

AU - Zhang, GQ

N1 - Conference code: 13

PY - 2012

Y1 - 2012

U2 - 10.1109/ESimE.2012.6191808

DO - 10.1109/ESimE.2012.6191808

M3 - Conference contribution

SN - 978-1-4673-1512-8

SP - 712

EP - 718

BT - Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

A2 - De Saint Leger et al, O

PB - IEEE

CY - Piscataway, NJ, USA

T2 - EuroSimE 2012

Y2 - 16 April 2012 through 18 April 2012

ER -

Yuan CA, Wei J, Ye H, Koh SW, Harianto S, van den Nieuwenhof M et al. Polymer-based 2D/3D wafer level heterogeneous integration for SSL module. In De Saint Leger et al O, editor, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE. 2012. p. 712-718 doi: 10.1109/ESimE.2012.6191808