Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

C Videlot, J Ackermann, F Fages, NT Nguyen, L Wang, PM Sarro, D Crawly, K Nikolic, M Forshaw

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)1618-1624
Number of pages7
JournalJournal of Micromechanics and Microengineering
Publication statusPublished - 2004


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