Porous silicon layer as a conformal insulation layer for high aspect ratio through wafer interconnects

TMH Pham, GP Salvador, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationEurosensors XIX
Editorsde R Reus, S Bouwstra
Place of PublicationPiscataway
PublisherIEEE Society
Pages1-4
Number of pages4
ISBN (Print)84-475-2984-3
Publication statusPublished - 2005
EventEurosensors XIX: The 19th European Conference on Solid-State Transducers - Barcelona, Spain
Duration: 11 Sep 200514 Sep 2005
Conference number: 19

Publication series

Name
PublisherIEEE

Conference

ConferenceEurosensors XIX
CountrySpain
CityBarcelona
Period11/09/0514/09/05

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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