@inproceedings{364d8eecbe8149e286a96e19e6348f4e,
title = "Porous silicon layer as a conformal insulation layer for high aspect ratio through wafer interconnects",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "TMH Pham and GP Salvador and PM Sarro",
year = "2005",
language = "Undefined/Unknown",
isbn = "84-475-2984-3",
publisher = "IEEE Society",
pages = "1--4",
editor = "{R Reus}, de and {S Bouwstra}",
booktitle = "Eurosensors XIX",
note = "null ; Conference date: 11-09-2005 Through 14-09-2005",
}