Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates

VG Kiutchoukov, Ph Philipov

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationAnnual school lectures
Editors Ph Philipov
Place of PublicationSofia
Publishers.n.
Pages145-159
Number of pages15
ISBN (Print)0861-0797
Publication statusPublished - 1999
Event20th International Spring Seminar on Semiconductor and Hybrid Technologies, Sofia - Sofia
Duration: 1 Jan 19981 Jan 1998

Publication series

Name
PublisherS.n.

Conference

Conference20th International Spring Seminar on Semiconductor and Hybrid Technologies, Sofia
Period1/01/981/01/98

Keywords

  • ZX Int.klas.verslagjaar < 2002

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