This paper presents a novel power electronics construction technology for surface mount technology (SMT) automated manufacturing of power converters- Power Sandwich. The Power Sandwich manufacturing method employs new x-dimension components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and can be soldered on both, top and bottom sides using the multilayer Power Sandwich assembly process. The process is compatible with standard SMT assembly line with some alternations. By arranging the components in different stack layers an increase in power density and better heat removal from the systems can be achieved. Power Sandwich is an enabling integration technology for achieving both SMT automated construction and high power densities of power electronics converters.
|Conference||ECCE Asia IPEC 2010, IEEE International Power Electronics Conference, Sapporo, Japan|
|Period||21/06/10 → 24/06/10|
- conference contrib. refereed
- Conf.proc. > 3 pag