Power sandwich: an integration technology for manufacturability

JA Ferreira, J Popovi¿-Gerber, I Josifovic

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    6 Citations (Scopus)

    Abstract

    This paper presents a novel power electronics construction technology for surface mount technology (SMT) automated manufacturing of power converters- Power Sandwich. The Power Sandwich manufacturing method employs new x-dimension components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and can be soldered on both, top and bottom sides using the multilayer Power Sandwich assembly process. The process is compatible with standard SMT assembly line with some alternations. By arranging the components in different stack layers an increase in power density and better heat removal from the systems can be achieved. Power Sandwich is an enabling integration technology for achieving both SMT automated construction and high power densities of power electronics converters.
    Original languageEnglish
    Title of host publication2010 International Power Electronics Conference (IPEC)
    EditorsH Akagi, RW de Doncker
    Place of PublicationSapporo, Japan
    PublisherIEEE Society
    Pages2120-2127
    Number of pages8
    ISBN (Print)978-1-4244-5394-8
    DOIs
    Publication statusPublished - 2010
    EventECCE Asia IPEC 2010, IEEE International Power Electronics Conference, Sapporo, Japan - Sapporo, Japan
    Duration: 21 Jun 201024 Jun 2010

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferenceECCE Asia IPEC 2010, IEEE International Power Electronics Conference, Sapporo, Japan
    Period21/06/1024/06/10

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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  • Cite this

    Ferreira, JA., Popovi¿-Gerber, J., & Josifovic, I. (2010). Power sandwich: an integration technology for manufacturability. In H. Akagi, & RW. de Doncker (Eds.), 2010 International Power Electronics Conference (IPEC) (pp. 2120-2127). IEEE Society. https://doi.org/doi:10.1109/IPEC.2010.5543737