Abstract
A powerful and effective design of a polymeric thermal microactuator is presented. The design has SU-8 epoxy layers filled and bonded in a meandering silicon (Si) microstructure. The silicon microstructure reinforces the SU-8 layers by lateral restraint. It also improves the transverse thermal expansion coefficient and heat transfer for the bonded SU-8 layers. A theoretical model shows that the proposed SU-8/Si composite can deliver an actuation stress of 1.30 MPa/K, which is approximately 2.7 times higher than the unconstrained SU-8 layer, while delivering an approximately equal thermal strain.
Original language | Undefined/Unknown |
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Pages (from-to) | 1-3 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 90 |
Issue number | 214103 |
Publication status | Published - 2007 |
Keywords
- academic journal papers
- CWTS JFIS >= 2.00