Powerful polymeric thermal microactuator with embedded silicon microstructure

GK Lau, JFL Goosen, F van Keulen, T Chu Duc, PM Sarro

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26 Citations (Scopus)


A powerful and effective design of a polymeric thermal microactuator is presented. The design has SU-8 epoxy layers filled and bonded in a meandering silicon (Si) microstructure. The silicon microstructure reinforces the SU-8 layers by lateral restraint. It also improves the transverse thermal expansion coefficient and heat transfer for the bonded SU-8 layers. A theoretical model shows that the proposed SU-8/Si composite can deliver an actuation stress of 1.30 MPa/K, which is approximately 2.7 times higher than the unconstrained SU-8 layer, while delivering an approximately equal thermal strain.
Original languageUndefined/Unknown
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Issue number214103
Publication statusPublished - 2007


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