Prediction of back-end process-induced wafer warpage and experimental verification

RBR van Silfhout, WD van Driel, Y Li, GQ Zhang, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	52nd electronic components & technology conference 2002
Place of Publication	Piscataway
Publisher	IEEE
Pages	1182-1187
Number of pages	6
ISBN (Print)	0-7803-7430-4
Publication status	Published - 2002
Event	Congress, San Diego - Piscataway Duration: 29 May 2002 → …

Name
Publisher	IEEE

Conference	Congress, San Diego
Period	29/05/02 → …

Keywords

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title = "Prediction of back-end process-induced wafer warpage and experimental verification",

keywords = "Conf.proc. > 3 pag",

author = "{van Silfhout}, RBR and {van Driel}, WD and Y Li and GQ Zhang and LJ Ernst",

year = "2002",

language = "Undefined/Unknown",

isbn = "0-7803-7430-4",

publisher = "IEEE",

pages = "1182--1187",

booktitle = "52nd electronic components & technology conference 2002",

address = "United States",

note = "Congress, San Diego ; Conference date: 29-05-2002",

}

TY - GEN

T1 - Prediction of back-end process-induced wafer warpage and experimental verification

AU - van Silfhout, RBR

AU - van Driel, WD

AU - Li, Y

AU - Zhang, GQ

AU - Ernst, LJ

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7430-4

SP - 1182

EP - 1187

BT - 52nd electronic components & technology conference 2002

PB - IEEE

CY - Piscataway

T2 - Congress, San Diego

Y2 - 29 May 2002

ER -