Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

WD van Driel, C Liu, GQ Zhang, JHJ Janssen, RBR van Silfhout, MAJ van Gils, LJ Ernst

Research output: Contribution to journalArticleScientificpeer-review

24 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)2019-2027
Number of pages9
JournalMicroelectronics Reliability
Publication statusPublished - 2004


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