Prediction of light scattering characteristics of particles and structures on surfaces by the coupled-dipole method

Brent M. Nebeker, Roland Schmehl, Greg W. Starr, Edwin Dan Hirleman

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

5 Citations (Scopus)

Abstract

The ability to predict angle-resolved light scattering characteristics of surface features, including particle contaminants and circuit structures, is identified as an important tool for the development of next generation wafer inspection systems. A model and associated code based on the coupled-dipole method used to model the light scattering is described. Then, predicted scattering signatures for polystyrene latex spheres and silicon dioxide features (nominal 1 micrometer size) on smooth silicon surfaces are reported. The surface features of interest were from the ASU/SRC block of the SEMATECH Patterned Wafer Defect Standard die developed by VLSI Standards, Inc. Finally, the computational results are compared with scattering measurements from individual particles and features. A coherent beam incident of the features on the surface had a wavelength of 632.8 nm, 7 mm beam spot size, and was at an incident angle of 45 degrees. A ringed photodetector centered on the specular reflection was used to measure the angle-resolved scatter. Over the range of scattering angles studied (10 degrees to 60 degrees), the results for differential scattering cross-section agreed to within a factor of 3 or 4.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsSusan K. Jones
Pages690-697
Number of pages8
Volume2725
Publication statusPublished - 1 Jan 1996
Externally publishedYes
EventMetrology, Inspection, and Process Control for Microlithography X - Santa Clara, CA, USA
Duration: 11 Mar 199613 Mar 1996

Conference

ConferenceMetrology, Inspection, and Process Control for Microlithography X
CitySanta Clara, CA, USA
Period11/03/9613/03/96

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