Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

D Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD van Driel, HJL Bressers, XJ Fan

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

30 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publication54th electronic components and technology conference. Vol. 2
Editors S.n.
Place of PublicationPiscataway
PublisherIEEE
Pages98-105
Number of pages8
ISBN (Print)0-7803-8365-6
Publication statusPublished - 2004
Event54th electronic components and technology conference - Las Vegas, United States
Duration: 1 Jun 20044 Jun 2004

Publication series

Name
PublisherIEEEE

Conference

Conference54th electronic components and technology conference
CountryUnited States
CityLas Vegas
Period1/06/044/06/04

Keywords

  • Conf.proc. > 3 pag

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