Prediction of thermo-mechanical integrity of wafer backend processes

V Gonda; JMJ den Toonder; J Beijer; GQ Zhang; RJOM Hoofman; LJ Ernst

Prediction of thermo-mechanical integrity of wafer backend processes

V Gonda, JMJ den Toonder, J Beijer, GQ Zhang, RJOM Hoofman, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Thermal & mechanical simulation and experiments in microelectronics and microsystems
Editors	LJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	359-363
Number of pages	5
ISBN (Print)	0-7803-7054-6
Publication status	Published - 2003
Event	EuroSimE 2003: 4th International Conference - Aix-en-Provence, France Duration: 30 Mar 2003 → 2 Apr 2003 Conference number: 4

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2003
Country/Territory	France
City	Aix-en-Provence
Period	30/03/03 → 2/04/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{5f12d8799a00485d8f0600926e3b0952,

title = "Prediction of thermo-mechanical integrity of wafer backend processes",

keywords = "Conf.proc. > 3 pag",

author = "V Gonda and {den Toonder}, JMJ and J Beijer and GQ Zhang and RJOM Hoofman and LJ Ernst",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7054-6",

publisher = "IEEE",

pages = "359--363",

editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",

booktitle = "Thermal & mechanical simulation and experiments in microelectronics and microsystems",

address = "United States",

note = "EuroSimE 2003 ; Conference date: 30-03-2003 Through 02-04-2003",

}

Gonda, V, den Toonder, JMJ, Beijer, J, Zhang, GQ, Hoofman, RJOM & Ernst, LJ 2003, Prediction of thermo-mechanical integrity of wafer backend processes. in LJ Ernst, GQ Zhang, R Dudek & O de Saint Leger (eds), Thermal & mechanical simulation and experiments in microelectronics and microsystems. IEEE, Piscataway, pp. 359-363, EuroSimE 2003, Aix-en-Provence, France, 30/03/03.

Prediction of thermo-mechanical integrity of wafer backend processes. / Gonda, V; den Toonder, JMJ; Beijer, J et al.
Thermal & mechanical simulation and experiments in microelectronics and microsystems. ed. / LJ Ernst; GQ Zhang; R Dudek; O de Saint Leger. Piscataway: IEEE, 2003. p. 359-363.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Prediction of thermo-mechanical integrity of wafer backend processes

AU - Gonda, V

AU - den Toonder, JMJ

AU - Beijer, J

AU - Zhang, GQ

AU - Hoofman, RJOM

AU - Ernst, LJ

N1 - Conference code: 4

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7054-6

SP - 359

EP - 363

BT - Thermal & mechanical simulation and experiments in microelectronics and microsystems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Dudek, R

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - EuroSimE 2003

Y2 - 30 March 2003 through 2 April 2003

ER -